ISigaba soLawulo lwe-Thyristor (Udidi lwe-alloying)

Inkcazo:

I-Thyristor, eyaziwa ngokuba yi-Silicon Control Rectifier (SCR), sisixhobo se-semiconductor samandla aphezulu aquka izakhiwo ezintathu ze-PN.Ngokubhekiselele ekusebenzeni, i-thyristor ayinayo kuphela i-conductivity ye-unidirectional, kodwa inokulawulwa okubaluleke ngakumbi kune-silicon rectifier element, ekuphela kweendawo ezimbini zokuqhuba kunye ne-off-state, ukulawula amandla amakhulu ngamandla amancinci, ukukhulisa amandla ukuya kumakhulu okanye amawaka amaxesha.Ukusabela kukhawuleza kakhulu, ukuvula kunye nokucima kwi-micro-seconds.Ukusebenza okungahambiyo, akukho zintlantsi, akukho ngxolo, ngelixa ukusebenza kakuhle kunye neendleko eziphantsi.Ke ngoko, ngakumbi kwinkqubo yonikezelo lwamandla aphezulu, i-thyristor isetyenziswe ngokubanzi kwisekethe yokulungisa, i-static bypass switch, i-contact-free output switch kunye nezinye iisekethe.

Umgangatho wokuvelisa i-thyristor kunye nokucubungula iteknoloji ye-RUNAU Electronics yaziswa ukusuka e-USA ukususela kwi-1980, njengovulindlela wokuvelisa i-thyristor e-China, iqela lobugcisa be-RUNAU lifumene ulwazi oluphambili kunye namava okuvelisa amaninzi ngaphezu kweminyaka engama-30.Kwisiseko senkqubo yokwenziwa kwemveli, amagcisa etalente ye-RUNAU Electronics aphuhlise itekhnoloji yobugcisa belizwe ekuveliseni i-thyristor eneempawu eziluncedo kwiimveliso zaseYurophu, umgangatho kunye nokusebenza kuphuculwe kakhulu, impumelelo enkulu ngakumbi ezuziweyo ekusebenziseni amandla ombane. amasimi, kwaye ixabiso elingaphezulu lenzelwe amaqabane.

Intshayelelo:

1. Itshiphu

I-chip ye-thyristor eyenziwe yi-RUNAU Electronics i-sintered alloying iteknoloji esebenzayo.I-silicon kunye ne-molybdenum wafer yayifakwe kwi-alloying nge-aluminiyam ecocekileyo (99.999%) phantsi kwe-vacuum ephezulu kunye nokusingqongileyo okuphezulu.Ulawulo lweempawu ze-sintering yinto ephambili yokuchaphazela umgangatho we-thyristor.Ulwazi lwe-RUNAU Electronics ngaphezu kokulawula ubunzulu be-alloy junction, flatness surface, i-alloy cavity kunye nobuchule obugcweleyo bokusasaza, isango eliphakathi, ipateni yesangqa sesangqa zisetyenzisiwe ukwenzela ukuba ukusebenza okuthembekileyo kunye okuphezulu okusebenzayo kwe-thyristor, ukuze qinisekisa ukusebenza komgangatho ophezulu.

2. Ukubethelela

Ngolawulo olungqongqo lwe-flatness kunye ne-parallelism ye-molybdenum wafer kunye nephakheji yangaphandle, i-chip kunye ne-molybdenum wafer iya kuhlanganiswa kunye nephakheji yangaphandle ngokuqinileyo kwaye ngokupheleleyo.Oku kuya kwandisa ukuchasana kwe-surge current kunye ne-high short circuit current.Kwaye umlinganiselo wetekhnoloji ye-electron evaporation yasetyenziswa ukwenza ifilimu eshinyeneyo ye-aluminiyam kumphezulu we-silicon wafer, kwaye umaleko we-ruthenium obekwe kumphezulu we-molybdenum uya kuphucula ukuxhathisa kokudinwa kwe-thermal kakhulu, ixesha lomsebenzi we-thyristor liya kwandiswa kakhulu.

Iinkcukacha zobugcisa

1. Isigaba esilawulwa yi-thyristor kunye ne-alloy type chip eyenziwe yi-RUNAU Electronics, uluhlu lwe-I_TAVukusuka kwi-300A ukuya kwi-6000A kunye ne-V_DRM/V_RRMukusuka 800V ukuya 4400V.
2. I_GT, V_GTkwaye nam_HAmaxabiso ovavanyo ku-25℃, ngaphandle kokuba kuchazwe ngenye indlela, zonke ezinye iiparamitha ngamaxabiso ovavanyo phantsi kwe-T._jm;
3. I²t=mna²F SM×tw/2,tw= Ububanzi besiseko samaza akhoyo eSinusoidal.Nge50Hz, I²t=0.005I²I-FSM(A²S);
4. nge60Hz:I_FSM(8.3ms)=Mna_FSM(10ms)×1.066,T_j=T_j;I²t(8.3ms)=Mna²T(10ms)×0.943,T_j=T_jm

Ipharamitha: